semequip blogspot.com

Semiconductor Equipment

In Front of Line FOL process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a.

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Semiconductor Packaging

Monday, March 9, 2009. Renesas Subsidiary Creates High-Temp QFN-Like Package. Renesas Northern Japan, a subsidiary of Renesas Technology Corp.

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Semiconductor Equipment

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In Front of Line FOL process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a.

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This web page semequip.blogspot.com states the following, "In Front of Line FOL process, there are three main process." We saw that the webpage said " Die Prep, Die Attach and Wire Bonding." It also said " Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a."

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