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This web page chippacking.blogspot.com states the following, "Semi conductor packaging, micro-electric packaging." We saw that the webpage said " Wednesday, May 4, 2011." It also said " Intel 22nm 3-D Tri-Gate Transistor Technology. The vertical fins of Intels revolutionary tri-gate transistors passing through the gates. New Transistors for 22 Nanometer Chips Have an Unprecedented Combination of Power Savings and Performance Gains. Intel announces a major technical breakthrough and historic innovation in microprocessors the worlds first 3-D transistors, called Tri-Gate, in a production technology." The header had semi conductor packaging 3D Integration Packaging Thermal and fluid consideration Intel STATS ChipPAC Amkor as the highest ranking optimized keyword.